The news here is not so much that [Guarav Singh] built this high quality industrial digital camera from scratch, but that’s in the way it was accomplished. That plus the amount of information that is packed into the write-up, of course. And the excellent photography.
Modularity was one of [Guarav]of design, with the intention of being able to swap out the sensor as technology evolves. To this end, [Guarav] came with a stack of three PCBs. The middle board of the stack contains a Lattice FPGA chip along with two 16MB RAMs and the FPGA configuration flash. The sensor board is on one side of the FBGA board, while the USB 3.0 board is on the other. Each six-layer board is a masterpiece of high-density design, and the engineering that went into interfacing them and fitting everything into a 3D-printed enclosure with an integrated aluminum C-mount ring is quite impressive. .
[Guarav]The description of goes into great detail about processing sensor data on the FPGA. In addition, there is a lot of practical information on the implementation of MIPI (Mobile Industry Processor Interface) and the CSI (Camera Serial Interface) specification. We’ve delved into this world before, but this project is a great hands-on explanation that could really help move your MIPI project forward.
Thanks for the advice, [STR-alorman].